We understand the importance of consistency and repeatability for scientific research and production runs. Therefore, we integrated multiple process control technologies to monitor and control the critical parameters, such as plasma sensor, pressure sensor and automatic mass flow controller for gas input. The operation of Tergeo plasma cleaner is fully automatic. Intuitive user interface together with 7-inch touchscreen make the operation of a scientific instrument as easy as a smart pad. Imbedded microcontroller supports 20 customizable recipes. With advanced process control technologies, Tergeo series plasma treatment system can deliver repeatable performance in day to day operation for different users.
Touchscreen controller and intuitive user interface
Tergeo series plasma cleaner integrated patent-pending plasma sensor technology from PIE Scientific. Plasma strength is measured quantitatively and displayed on the LCD touchscreen controller in real time. Quantitative data is the key to achieve repeatable and consistent results. With the help of the plasma sensor, user doesn't need to be a plasma expert to optimize recipes for their applications.
Direct immersion mode plasma cleaning, plasma is generated inside the sample chamber. Samples are immersed in plasma.
Tergeo series plasma cleaners are the most advanced tabletop plasma cleaners in the market. Unlike most other plasma cleaners, Tergeo series plasma cleaners have integrated two different plasma sources in one machine----an in-situ plasma source and a remote plasma source. Main sample chamber is made of high purity quartz tube. When plasma is generated inside the main sample chamber, it is called immersion mode processing. Samples are immersed in plasma in this operation mode. Samples are subject to both energetic ion bombardment and chemical reaction with neutral radical species. Immersion mode processing is good for high speed etching, surface modification. However, if the sample contains thin gate oxide, ESD sensitive device, anti-reflective coating, graphene, nanotube nano particles, DLC (diamond-like carbon), carbon fiber or holey carbon grid for TEM, immersion mode processing may cause irreversible damage to the sample. In this case, downstream processing mode is recommended. In this mode, plasma is generated inside a remote plasma source attached to the side of the main sample chamber. Only neutral radical species generated inside the remote plasma source can diffuse into the sample chamber and etch away contaminants on the sample surface. Energetic ions are confined in the remote plasma source. Therefore, there is no ion sputtering damage to the sample surface.
A recipe controls the selection of plasma processing mode (immersion or downstream), gas flow rate from different gas channels, rf power level, rf pulse duty ratio, cleaning time and purging action after cleaning. One recipe can only perform single plasma treatment step. Tergeo plasma cleaner also supports "Job sequence" operation. A job sequence executes up to three processing steps (e.g. three recipes) sequentially with just one click.
Pulsed plasma sometimes can change discharge chemistry and alter the properties of the deposited film compared with traditional CW plasma. Research also indicates that etch/deposition rate can be maintained in pulsed operation despite lower average power. In the meantime, "dust" particle formation, trenching, notching, and charging damage can be reduced. For fluorocarbon PECVD process, pulsed operation can yield rougher surface structure and providing greater hydrophobicity. Tergeo plasma system can be pulsed at 480Hz. Duty ratio can be varied from 1/256 to CW. Pulsed operation on Tergeo plasma treatment system provide a new dimension for researchers to explore the novice characteristics of plasma processing for etching and film deposition
Pulsed mode operation can ignite plasma at high pressure with lower average power.